ECEN 5730 · PCB Design & Manufacture

Sepideh
Mohammadi

PCB Designer & Graduate Research assistant · CU Boulder

Designing boards from napkin sketch to working silicon: power delivery networks, signal integrity, and embedded systems — documented across 4 boards and 8 labs.

Altium Designer KiCad ATMEGA328 Power Integrity Signal Integrity I²C / UART / SPI 555 Timer Thevenin Analysis
Sepideh Mohammadi
Sepideh Mohammadi
Graduate Research Assistant · Computer Science
4 PCBs Built
8 Labs Done
0 Hard Errors
Curiosity

Engineer who builds
things that work.

I am a Graduate research assistant in Computer Science at CU Boulder with a background in Electrical Engineering. My research focuses on microfluidic lab-on-a-chip systems, digital microfluidics, embedded electronics, and hardware-software integration for biomedical applications. I am interested in developing practical intelligent systems that combine hardware, software, and AI to solve real-world problems in biomedical engineering, and robotics.

This portfolio documents my journey through Practical PCB Design & Manufacture (ECEN 5730) — from first principles (Thevenin equivalents, loop inductance, decoupling capacitor selection) through full-stack board design in Altium Designer, assembly, oscilloscope bring-up, and formal reporting.

Every board I designed passed bring-up with zero hard errors. My Golden Arduino (Board 3) achieved 6× lower near-field emissions than a commercial Arduino Uno.

Current Proficiency

Altium Designer
85%
KiCad
75%
Oscilloscope
90%
Power Integrity
80%
Signal Integrity
78%
Arduino / Embedded C
80%
DFM / Manufacturability
82%

All Projects

Four full PCB designs and eight hands-on labs — each building systematically on the last, from breadboard prototyping to multi-layer professional boards.

LAB 02 Solderless Breadboard

555 Timer Lab Report — NE555 vs TLC555

This lab compares the NE555 bipolar timer and the TLC555 CMOS timer in astable mode. I built the circuit on a solderless breadboard, measured frequency, rise time, fall time, and LED load current, and then selected the better timer for the PCB design.

≈463 Hz NE555 measured frequency
89 ns NE555 rise time
14.8 ns TLC555 rise time
NE555 selected for PCB design
Step 01

Understand the 555 Timer Circuit

A 555 timer can generate a repeating square wave without an external trigger. The frequency and duty cycle are controlled by two resistors, RA and RB, and one timing capacitor. This makes the 555 timer useful for blinking LEDs, clock pulses, tone generation, and PWM-style timing.

555 timer circuit diagram
Step 02

Build the Circuit on a Solderless Breadboard

I placed the 555 timer circuit on a solderless breadboard and powered it with 5 VDC. The output was connected to the oscilloscope so I could measure frequency, duty cycle, rise time, fall time, and LED load current using different resistors.

555 timer solderless breadboard setup
Step 03

Measure the NE555 Timer

For the NE555 timer, the measured frequency was about 463 Hz, close to the theoretical value of about 481 Hz for RA = 1 kΩ, RB = 1 kΩ, and C = 1 µF. The measured rise time was 89 ns, and the fall time was 33.8 ns. The NE555 also provided higher output current when driving the LED load.

NE555 oscilloscope measurement results
Step 04

Measure the TLC555 Timer

I repeated the same test with the TLC555 CMOS timer. The measured frequency was close to the NE555 result, but the TLC555 switched much faster. The measured rise time was about 14.8 ns, and the fall time was about 11.1 ns.

TLC555 oscilloscope measurement results
Step 05

Compare the Results

Both timers produced nearly the same oscillation frequency, but their output behavior was different. The TLC555 had faster switching edges, while the NE555 provided stronger current drive for the LED load.

MeasurementNE555TLC555
Rise time89 ns14.8 ns
Fall time33.8 ns11.1 ns
Frequency≈463 Hz≈485 Hz
LED current with 1 kΩ2.5 mA2.7 mA
LED current with 47 Ω76 mA61.7 mA
Step 06

Final Decision for PCB Design

Why I selected the NE555
  • The TLC555 is faster and produces sharper switching edges.
  • The NE555 provides stronger current drive, which is useful for driving LED loads.
  • The NE555 rise and fall times are still acceptable because the target frequency is only around 500 Hz.
  • For the PCB design, the NE555 was selected because it is more robust for this load-driving application.
NE555TLC555Astable Mode OscilloscopeBreadboardPCB Decision
LAB 05 SBB Experiment

PDN and Slammer Circuit — Full Lab Report

This lab studies how sudden current switching affects a 9 V power rail using a slammer circuit. I built the circuit on a solderless breadboard, measured voltage droop during slow and fast switching edges, and compared how 1 µF and 1000 µF decoupling capacitors reduce power rail noise when placed near or far from the switching transistor.

1.811 V fast-edge drop without decoupling
640 mV fast-edge drop with 1 µF near
246 mV fast-edge drop with 1000 µF near
2.06 Ω estimated Thevenin resistance
Main Results
  • Fast switching caused a much larger voltage drop than slow switching.
  • Without decoupling, the fast-edge voltage drop reached about 1.811 V.
  • A 1 µF capacitor reduced the drop but was not enough to fully stabilize the rail.
  • A 1000 µF capacitor placed near the transistor gave the strongest improvement.
  • Capacitor placement close to the switching device reduced loop inductance and improved performance.
PDNSlammer CircuitTIP41C MCP601DecouplingLoop InductancePower Integrity
LAB 15 Analysis

Hex Inverter High-Speed Digital Circuit — Switching Noise Report

This lab compares switching noise, edge speed, and rail stability for three layout cases: good layout, good layout with the decoupling capacitor far away, and bad layout. The goal is to show how return path quality and capacitor placement affect high-speed digital behavior.

2.25 ns good layout rise time
4.86 ns bad layout rise time
274 mV good rail collapse
1031 mV bad rail collapse
Main Results
  • Good layout produced the fastest and cleanest transitions.
  • Bad layout showed slower edges and larger rail noise due to poor return paths.
  • Moving the capacitor far away also degraded performance, even with a solid return plane.
  • The experiment confirms that close decoupling and continuous ground planes are critical for SI and PI.
LayoutRise TimeFall TimeRail Collapse
Good Layout2.25 ns1.89 ns274 mV / 181 mV
Bad Layout4.86 ns3.92 ns1031 mV / 2763 mV
Good, Cap Far3.78 ns2.47 ns709 mV / 829 mV
High-Speed DigitalHex InverterReturn Path DecouplingRail CollapseSignal Integrity
BOARD 02 PCB Design

Hex Inverter Board — Good vs Bad Layout Report

This report demonstrates how PCB layout decisions affect switching noise and power delivery network behavior. The board compares two identical hex inverter circuits: one with good layout practices and one with poor layout practices. The good layout uses close decoupling and a continuous return plane, while the bad layout uses longer return paths and far decoupling.

1.76 ns good layout rise time
5.58 ns bad layout rise time
0.917 V good rail compression
1.85 V bad rail compression
Main Results
  • The good layout showed faster switching edges and lower power rail disturbance.
  • The bad layout had slower transitions because of poor return paths and far decoupling.
  • Good layout rise time was about 1.76 ns, while bad layout rise time was about 5.58 ns.
  • Good layout fall time was about 2.64 ns, while bad layout fall time was about 9.86 ns.
  • The experiment confirmed that close decoupling and a continuous ground return plane improve SI and PI.
MeasurementGood LayoutBad Layout
Rise time1.76 ns5.58 ns
Fall time2.64 ns9.86 ns
Quiet High Vp-p690 mV1900 mV
Rail compression0.917 V1.85 V
Output Thevenin resistance≈66 Ω
Hex InverterSN74AHC14DRNE555 Good LayoutBad LayoutGround Plane DecouplingSwitching Noise
LAB 16 Signal Integrity

Differential vs Single-Ended Signals — Ground Noise Study

This lab studies how ground noise affects analog measurements. I used a TMP36 temperature sensor, ADS1115 16-bit ADC, Arduino Uno, and I²C communication to compare single-ended and differential measurements under normal and noisy ground conditions.

ADS1115 16-bit ADC
±1.024 V ADC range
31.25 µV LSB size
93 mV single-ended noise
Main Results
  • With no injected ground noise, both single-ended and differential measurements read about 0.734 V.
  • With ground-current injection, the single-ended reading shifted because it used the local ground reference.
  • The differential measurement rejected the common-mode ground shift and stayed stable.
  • This shows why differential measurement is more robust for noisy analog sensing.
Differential SignalSingle-EndedTMP36 ADS1115I²CGround Noise
LAB 18 Power Analysis

Measuring Inrush Current and Steady-State Current

This lab measures steady-state and inrush current in a 555 timer circuit. I used a 1 Ω sense resistor and oscilloscope math mode to measure the voltage across the resistor and convert it to current.

1 Ω sense resistor
≈360 Hz 555 output frequency
≈3.5 mA steady-state current
≈1 A inrush peak
Main Results
  • The 555 timer output was measured as a square wave at approximately 360 Hz.
  • The steady-state voltage across the 1 Ω sense resistor was about 35 mV, corresponding to about 3.5 mA.
  • During power-up, the capacitor charging transient produced a short inrush current spike.
  • The experiment demonstrates how current can be measured safely using a sense resistor and oscilloscope math.
Inrush CurrentSteady-State CurrentSense Resistor Oscilloscope Math555 Timer
BOARD 03 PCB Design

Golden Arduino — Custom Arduino Uno Board Report

This board is a custom Arduino Uno-style design built with ATMEGA328, CH340G USB-to-UART, a 3.3 V LDO, USB mini-B, ICSP bootloading, ferrite filtering, crystals, status LEDs, and test points for validating power, USB, I²C, UART, and SPI signals.

ATMEGA328 main MCU
CH340G USB-UART
16 MHz MCU crystal
ICSP bootloaded successfully
Main Results
  • The ATMEGA328 was successfully bootloaded using the ICSP header.
  • The board includes USB, power, reset, crystal, and test-point features similar to an Arduino Uno.
  • The design supports bring-up and signal validation through labeled test points.
  • The project demonstrates a full PCB design workflow from schematic to functioning embedded board.
Golden ArduinoATMEGA328CH340G ICSPUSB-UARTEmbedded PCB
LAB 21 & 22 VRM Characterizer

VRM Characterizer — Breadboard Instrument Report

This lab builds a breadboard version of the VRM Characterizer. The circuit applies a controlled load current, measures open-circuit and loaded voltage, and computes the Thevenin resistance of voltage sources using Arduino, DAC, ADC, op-amp, MOSFET, and a sense resistor.

MCP4725 DAC output control
ADS1115 ADC measurement
48–52 Ω function generator Rth
1.34–1.39 Ω Arduino VRM Rth
Main Results
  • The circuit measured Thevenin voltage and resistance by sweeping load current.
  • The function generator stabilized around 48–52 Ω at higher current values.
  • The Arduino VRM stayed nearly flat around 1.34–1.39 Ω over the measured current range.
  • The lab validated the core measurement concept before building the final Instrument Droid PCB.
VRMThevenin ResistanceMCP4725 ADS1115MOSFET LoadArduino
BOARD 04 PCB Design · Capstone

Instrument Droid — Automatic Rth Measurement PCB Report

Instrument Droid is a custom PCB designed to automatically measure the Thevenin resistance of a voltage supply up to 12 V. The board integrates ATMEGA328 control, DAC/ADC measurement, op-amp buffering, MOSFET loading, OLED display, smart LEDs, buzzer, USB interface, and test points for validation.

4-layer instrument PCB
12 V max supply under test
OLED Rth display
ATMEGA328 control MCU
Main Results
  • The board was designed to measure Rthevenin automatically for voltage supplies up to 12 V.
  • The design combines DAC current control, ADC voltage sensing, op-amp buffering, and MOSFET loading.
  • The ATMEGA328 was bootloaded and the board was validated through test points and scope measurements.
  • The circular PCB served as the capstone design for the PCB design and manufacture course.
Instrument DroidRth MeasurementATMEGA328 ADC/DACOLED4-Layer PCBCapstone PCB

Skills Growth

Measured on a 1–5 scale at the start and end of ECEN 5730. Evidence links to project deliverables.

SkillBeforeAfterEvidence
KiCad PCB Design2/54/5Schematic → Layout workflow
Altium Designer1/54/5Board 2–4 full designs
DFM / DRC / Gerbers1/55/5All boards ordered from JLC
Signal Integrity1/54/5Good/bad layout Lab 15
Power Integrity1/54/5Lab 5 decoupling study
Oscilloscope / Probing2/55/5Inrush, NFE, quiet-node
Embedded / Arduino C2/54/5Board 4 firmware, I²C driver
Thevenin / PDN Analysis1/55/5Lab 5, Board 3 & 4

Core Competencies

Power Delivery Network (PDN) Design 92%
Signal Integrity & Return Paths 88%
Schematic Capture & BOM 90%
PCB Layout & Design Rules 85%
Board Bring-Up & Debug 95%
Embedded Firmware (Arduino) 82%

Learning Outcomes

🔌
Concept → Working Board
From napkin sketch through schematic, layout, Gerbers, and assembly — all 4 boards built and functioning.
SI / PI Engineering
Quantified loop inductance, decoupling capacitor sizing (C = I·dt/dv), and Thevenin resistance of real power supplies.
📐
Trade-off Analysis
Documented good vs bad layout impact: up to 6× lower emissions, 5× less noise, 3× faster transitions.
🔬
Oscilloscope Proficiency
Measured inrush current (up to 5.14 A), near-field emissions, quiet-low/high on-die noise, I²C timing, and Rth sweeps.
🛡️
Zero Hard Errors
Every board passed bring-up. Board 4 had zero hard or soft errors. Board 3's only issue was a routing omission with an easy workaround.
📡
Communication
Full written reports for each board and lab: scope screenshots, calculations, data tables, and design-practice rationale.